The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2012
Filed:
Oct. 03, 2007
Masahito Ohkido, Okayama, JP;
Wataru Ueno, Tokyo, JP;
Jitsuo Oishi, Kanagawa, JP;
Shuta Kihara, Kanagawa, JP;
Masahito Ohkido, Okayama, JP;
Wataru Ueno, Tokyo, JP;
Jitsuo Oishi, Kanagawa, JP;
Shuta Kihara, Kanagawa, JP;
Mitsubishi Gas Chemical Company, Inc, Tokyo, JP;
Abstract
It relates to a highly heat resistant thermosetting polyimide resin composition that is cured at a temperature of 150° C. or less, and provides a cured product that generates a less amount of decomposed gas even under heating to 250° C., and has flexibility and adhesiveness. A two-component thermosetting polyimide resin composition containing a liquid A containing a polyimide (a) having a main chain constituted by a repeating unit having a polyoxyalkylenediamine structure with amino groups on both ends thereof, and a liquid B containing a bismaleimide compound, and a cured product of a thermosetting polyimide resin composition obtained by mixing these two liquids and curing the mixture under heating.