The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2012

Filed:

Dec. 04, 2009
Applicants:

Tomoyuki Ishimatsu, Tochigi, JP;

Daisuke Sato, Tochigi, JP;

Hiroki Ozeki, Tochigi, JP;

Inventors:

Tomoyuki Ishimatsu, Tochigi, JP;

Daisuke Sato, Tochigi, JP;

Hiroki Ozeki, Tochigi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B31B 1/60 (2006.01); B32B 37/00 (2006.01); B32B 7/12 (2006.01); B32B 9/04 (2006.01); A61F 13/15 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.


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