The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2012

Filed:

Mar. 23, 2011
Applicants:

Philip T. Stokoe, Attleboro, MA (US);

Mark W. Gailus, Concord, MA (US);

Huilin Ren, Amherst, NH (US);

Donald A. Girard, Jr., Bedford, NH (US);

Inventors:

Philip T. Stokoe, Attleboro, MA (US);

Mark W. Gailus, Concord, MA (US);

Huilin Ren, Amherst, NH (US);

Donald A. Girard, Jr., Bedford, NH (US);

Assignee:

Amphenol Corporation, Wallingford Center, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An interconnection system that includes a daughter card and backplane electrical connectors, each mounted to a printed circuit board at a connector footprint. The backplane connector has conductive elements with transition regions that allow the mating contact portions to be positioned on a uniform pitch while contact tail portions can be shaped to improve signal integrity or to provide a more compact and/or mechanically robust footprint. The conductive elements in both connectors are configured such that the contact tails of the ground conductors align from column to column, but the planar portions of the ground conductors in one column align with a pair of signal conductors in the other column, which improves mechanical and signal integrity. Mechanical integrity may be improved by forming the connector footprints with pads for the ground conductors that span multiple columns.


Find Patent Forward Citations

Loading…