The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2012
Filed:
Mar. 23, 2009
Yoshikazu Higashi, Moriyama, JP;
Satoshi Abe, Moriguchi, JP;
Isao Fuwa, Osaka, JP;
Masataka Takenami, Moriguchi, JP;
Norio Yoshida, Nara, JP;
Yoshikazu Higashi, Moriyama, JP;
Satoshi Abe, Moriguchi, JP;
Isao Fuwa, Osaka, JP;
Masataka Takenami, Moriguchi, JP;
Norio Yoshida, Nara, JP;
Panasonic Corporation, Osaka, JP;
Abstract
Disclosed is a mold for resin injection molding that can realize rapid heating or cooling. A resin injection molding mold includes a cavity mold and a core mold and is produced on a base plate by metal photofabrication. The cavity mold is provided with a cavity warm water circuit for allowing warm water for heating to flow and a cavity cold water circuit for allowing cold water for cooling to flow. The core mold is also provided with a core warm water circuit and a core cold water circuit. The core mold includes an air blowing passage for feeding warm air or cold air into a resin molding part and a suction passage () for sucking a gas within the resin molding part. The resin molding part side of the air blowing passage and the suction passage is formed of a low-density shaping part that has a low metallic powder sintered density and is permeable to gas. Warm air or cold air can be blown through the low-density shaping part, whereby rapid heating or cooling of the resin injection molding mold can be realized.