The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2012

Filed:

May. 19, 2008
Applicants:

Christopher Hofmeister, Hampstead, NH (US);

Martin R. Elliot, Pepperell, MA (US);

Alexander Krupyshev, Chelmsford, MA (US);

Joseph Hallisey, Pepperell, MA (US);

Joseph A. Kraus, Pepperell, MA (US);

William Fosnight, Carlisle, MA (US);

Craig J. Carbone, Lunenburg, MA (US);

Jeffrey C. Blahnik, Pepperell, MA (US);

Ho Yin Owen Fong, Santa Clara, CA (US);

Inventors:

Christopher Hofmeister, Hampstead, NH (US);

Martin R. Elliot, Pepperell, MA (US);

Alexander Krupyshev, Chelmsford, MA (US);

Joseph Hallisey, Pepperell, MA (US);

Joseph A. Kraus, Pepperell, MA (US);

William Fosnight, Carlisle, MA (US);

Craig J. Carbone, Lunenburg, MA (US);

Jeffrey C. Blahnik, Pepperell, MA (US);

Ho Yin Owen Fong, Santa Clara, CA (US);

Assignee:

Brooks Automation, Inc., Chelmsford, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B65G 49/07 (2006.01);
U.S. Cl.
CPC ...
Abstract

A substrate processing tool including a frame forming at least one isolatable chamber configured to hold a controlled atmosphere, at least two substrate supports located within each of the at least one isolatable chamber, each of the at least two substrate supports being stacked one above the other and configured to hold a respective substrate and a cooling unit communicably coupled to the at least two substrate supports such that the at least two substrate supports and cooling unit effect simultaneous conductive cooling of each of the respective substrates located on the at least two substrate supports.


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