The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2012

Filed:

Nov. 30, 2004
Applicants:

Jeffrey J. Kilwin, St. Peters, MO (US);

Ronald J. Newcomer, St. Louis, MO (US);

Inventors:

Jeffrey J. Kilwin, St. Peters, MO (US);

Ronald J. Newcomer, St. Louis, MO (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A47F 1/14 (2006.01); A47G 1/16 (2006.01); B60R 1/02 (2006.01); A47B 91/00 (2006.01); A47G 29/00 (2006.01); B65D 19/00 (2006.01); G09F 15/00 (2006.01); G09F 15/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A minimum bond assurance feature for a pi-joint assembly is provided. The pi-joint assembly includes a substructure, a member coupled to the substructure. The substructure includes one or more standoff extending above one of the lower side, the front side and the back side of the substructure. The standoff includes a space location control surface. The member includes a base, a pair of axially elongated leg extending from the base to define a channel therebetween. The channel of the member has a first channel side, a channel floor and a second channel side, wherein the space location control surface may contact the member maintaining a standoff distance between the one of the lower side, the front side and the back side of the substructure and corresponding one of the channel floor, the first channel side and the second channel side of the member. A method of assembling a pi-joint assembly of the present invention is also provided.


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