The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2012
Filed:
Sep. 30, 2009
Takashi Mori, Inuyama, JP;
Takuya Mizuno, Hashima, JP;
Toshiyuki Matsuoka, Nagoya, JP;
Yoshinori Tsujimura, Kasugai, JP;
Takio Kojima, Ichinomiya, JP;
Yuzo Higuchi, Komaki, JP;
Takashi Mori, Inuyama, JP;
Takuya Mizuno, Hashima, JP;
Toshiyuki Matsuoka, Nagoya, JP;
Yoshinori Tsujimura, Kasugai, JP;
Takio Kojima, Ichinomiya, JP;
Yuzo Higuchi, Komaki, JP;
NGK Spark Plug Co., Ltd., Aichi, JP;
Abstract
A pressure sensor has a Si device having a first main surface that has a bonded area, a second main surface parallel to the first main surface, a pressure-sensitive resistor formed on the first main surface, and a joining assist pattern formed on the first main surface, and a pressing member bonded to the bonded area on the first main surface and compressing the Si device in a thickness direction. The pressure-sensitive resistor has a first bonded section which is placed within the bonded area of the first main surface and is bonded to the pressing member. The joining assist pattern has a second bonded section which is made of the same material as the first bonded section of the pressure-sensitive resistor and is placed within the bonded area of the first main surface and is bonded to the pressing member.