The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2012

Filed:

Jan. 19, 2011
Applicants:

Robert Fleming, San Jose, CA (US);

Lex Kosowsky, San Jose, CA (US);

Shurui Shang, San Jose, CA (US);

Bhret Graydon, San Jose, CA (US);

Xiaofeng Chen, San Jose, CA (US);

Glen Irvin, Newark, CA (US);

Inventors:

Robert Fleming, San Jose, CA (US);

Lex Kosowsky, San Jose, CA (US);

Shurui Shang, San Jose, CA (US);

Bhret Graydon, San Jose, CA (US);

Xiaofeng Chen, San Jose, CA (US);

Glen Irvin, Newark, CA (US);

Assignee:

Shocking Technologies, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.


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