The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2012
Filed:
Dec. 10, 2009
Koji Miyata, Osaka, JP;
Hiroyuki Nakanishi, Osaka, JP;
Masahiro Okita, Osaka, JP;
Kazuaki Tatsumi, Osaka, JP;
Masato Yokobayashi, Osaka, JP;
Koji Miyata, Osaka, JP;
Hiroyuki Nakanishi, Osaka, JP;
Masahiro Okita, Osaka, JP;
Kazuaki Tatsumi, Osaka, JP;
Masato Yokobayashi, Osaka, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
Patterns provided on a surface of a substrate include an adhesion area pattern and one or more non-adhesion area patterns. A chip electrode on a backside of a semiconductor chip is attached to the adhesion area pattern by a conductive adhesive. Consequently, an area of patterns subjected to gold plating that is stable in a steady state is smaller in a substrate of the present invention than in a conventional substrate, resulting in reduction in costs. Further, the chip electrode is attached to the adhesion area pattern by a conductive adhesive in a liquid form. Consequently, a semiconductor device of the present invention allows reducing use of an expensive conductive adhesive compared with a conventional semiconductor device, resulting in reduction in costs.