The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2012

Filed:

Jan. 18, 2011
Applicant:

Takatoshi Osumi, Nara, JP;

Inventor:

Takatoshi Osumi, Nara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multilayer semiconductor device includes an interconnect substrate provided with first electrode lands and connection terminals on a top surface; a semiconductor chip mounted on the top surface of the interconnect substrate; first connecting members connecting the first electrode lands to a circuit formation surface of the semiconductor chip; first metal posts provided on the connection terminals; encapsulating resin filling a space between the interconnect substrate and the semiconductor chip; a package provided with second electrode lands on a main surface; and second connecting members electrically connecting the first metal posts to the second electrode lands.


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