The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2012
Filed:
Apr. 04, 2007
Shohei Hata, Yokohama, JP;
Eiji Sakamoto, Yokohama, JP;
Naoki Matsushima, Yokohama, JP;
Hideaki Takemori, Hitachi, JP;
Masatoshi Seki, Hitachi, JP;
Shohei Hata, Yokohama, JP;
Eiji Sakamoto, Yokohama, JP;
Naoki Matsushima, Yokohama, JP;
Hideaki Takemori, Hitachi, JP;
Masatoshi Seki, Hitachi, JP;
Hitachi Kyowa Engineering Co., Ltd., Ibaraki, JP;
Abstract
Submounts for mounting optical devices which have an excellent heat radiating property and can be formed in a wafer state in batch are provided. A metallized electrode including optical device mounting parts and wiring parts is formed on a surface of a first substrate containing an insulating material as a main component, a through hole is formed in a glass substrate serving as a second substrate, the optical device mounting parts of the first substrate are aligned to be located inside the through hole of the second substrate, and the first substrate and the second substrate are joined together by use of a method such as anodic bonding.