The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2012
Filed:
Mar. 06, 2008
Akira Mori, Kisarazu, JP;
Kiwamu Tokuhisa, Kisarazu, JP;
Kazuhiko Nakahara, Kitakyushu, JP;
Masashi Kaji, Kitakyushu, JP;
Akira Mori, Kisarazu, JP;
Kiwamu Tokuhisa, Kisarazu, JP;
Kazuhiko Nakahara, Kitakyushu, JP;
Masashi Kaji, Kitakyushu, JP;
Nippon Steel Chemical Co., Ltd., Tokyo, JP;
Abstract
Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.