The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2012
Filed:
Apr. 02, 2004
Masahiro Tada, Kanagawa, JP;
Takashi Kinoshita, Kanagawa, JP;
Masahiro Tanaka, Kanagawa, JP;
Masanari Yamaguchi, Kanagawa, JP;
Shun Mitarai, Kanagawa, JP;
Koji Naniwada, Kanagawa, JP;
Masahiro Tada, Kanagawa, JP;
Takashi Kinoshita, Kanagawa, JP;
Masahiro Tanaka, Kanagawa, JP;
Masanari Yamaguchi, Kanagawa, JP;
Shun Mitarai, Kanagawa, JP;
Koji Naniwada, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A method for manufacturing a micromachine is provided which can remove a sacrifice layer and can perform sealing without using a specific packaging technique. In a method for manufacturing a micromachine () including an oscillator (), a step of forming a sacrifice layer around a movable portion of the oscillator (); a step of covering a sacrifice layer with an overcoat film (), followed by the formation of a penetrating hole () reaching the sacrifice layer in the overcoat layer (); a step of performing sacrifice-layer etching for removing the sacrifice layer using the penetrating hole () in order to form a space around the movable portion; and a step of performing a film-formation treatment at a reduced pressure following the sacrifice-layer etching so as to seal the penetrating hole ().