The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2012

Filed:

May. 30, 2007
Applicants:

Toyosei Takahashi, Tokyo, JP;

Junya Kusunoki, Tokyo, JP;

Kazuto Oonami, Tokyo, JP;

Mitsuo Sugino, Tokyo, JP;

Masakazu Kawata, Tokyo, JP;

Rie Takayama, Tokyo, JP;

Seiji Oohashi, Tokyo, JP;

Inventors:

Toyosei Takahashi, Tokyo, JP;

Junya Kusunoki, Tokyo, JP;

Kazuto Oonami, Tokyo, JP;

Mitsuo Sugino, Tokyo, JP;

Masakazu Kawata, Tokyo, JP;

Rie Takayama, Tokyo, JP;

Seiji Oohashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a light receiving deviceincludes: providing a resin layercontaining a photo curing resin on a transparent substratewhere a plurality of transparent substrate portionsA are integrated so that the resin layer covers the transparent substrate; selectively irradiating the resin layerwith light, followed by a developing process, so that the resin layerremains in regions of the transparent substratewhich surround portions corresponding to regions facing light receiving portionsin the transparent substrate portionsA; dividing the transparent substrateinto units of transparent substrate portionsA so that a plurality of transparent substrate portionsA are obtained; dividing the base substrateinto units of base substrate portionsA so that a plurality of base substrate portionsA are obtained; and joining the base substrate portionsA and the transparent substrate portionsA via the resin layer


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