The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2012

Filed:

Mar. 18, 2008
Applicants:

Motoaki Tamaya, Tokyo, JP;

Chise Nanba, Tokyo, JP;

Akira Nakamura, Tokyo, JP;

Keiichi Fukuda, Tokyo, JP;

Koji Funaoka, Tokyo, JP;

Manabu Kawakami, Tokyo, JP;

Masamitsu Okamura, Tokyo, JP;

Inventors:

Motoaki Tamaya, Tokyo, JP;

Chise Nanba, Tokyo, JP;

Akira Nakamura, Tokyo, JP;

Keiichi Fukuda, Tokyo, JP;

Koji Funaoka, Tokyo, JP;

Manabu Kawakami, Tokyo, JP;

Masamitsu Okamura, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Chiyoda-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

When a laser light source module includes a heat sink in which a solid laser element, an excitation light source, and a wavelength conversion element are arranged and a stem that supports the heat sink, wherein the heat sink is separated into three blocks, namely a first block including a laser oscillating unit for the solid laser element is arranged, a second block including a semiconductor laser element that emits excitation light for the laser oscillating unit and a first temperature sensor are arranged and on a specific surface of which the first heater is arranged, and a third block including the wavelength conversion element that converts the wavelength of the fundamental laser beam and a second temperature sensor are arranged and on a specific surface of which a second heater is arranged, enabling thus downsizing of the module and improvement of the positioning accuracy of the elements.


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