The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2012

Filed:

May. 20, 2010
Applicant:

Toshimasa Tsuda, Saitama, JP;

Inventor:

Toshimasa Tsuda, Saitama, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/09 (2006.01); H01L 41/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

An object of the present invention is to economically manufacture a piezoelectric component having superior molding pressure resistance and reduced height. The present invention comprising: a piezoelectric substrate with piezoelectric devices formed on a principle surface; a device wiring section formed on the principle surface; protective film having a terminal electrode connected to the wiring section formed on its upper surface; a rewiring layer on an upper surface of the protective film and connected to a wiring section of another electrode; an inorganic material-buffer layer covers an entire upper surface of the rewiring layer excluding the piezoelectric devices; a photosensitive film-outer periphery wall, formed on an upper surface of the buffer layer; a photosensitive film-first ceiling layer, having mica filler added thereto is formed on an upper surface of the outer periphery wall; an insulating material mesh-shaped member, installed on an upper surface of the first ceiling layer; a photosensitive resin film-second ceiling layer with mica filler added thereto covers an upper surface of the mesh-shaped member; and through electrodes that pass through the first and second ceiling layers, the outer periphery wall, and the mesh-shaped member, thus between the outer periphery wall, the first ceiling layer, and the principle surface of the piezoelectric substrate, there is a hollow that accommodates the piezoelectric devices.


Find Patent Forward Citations

Loading…