The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2012

Filed:

Sep. 25, 2006
Applicants:

Tetsuya Tsumura, Kadoma, JP;

Hiroharu Nishiyama, Kadoma, JP;

Etsuo Tsujimoto, Kadoma, JP;

Inventors:

Tetsuya Tsumura, Kadoma, JP;

Hiroharu Nishiyama, Kadoma, JP;

Etsuo Tsujimoto, Kadoma, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/03 (2006.01); H05K 1/16 (2006.01); H05K 7/20 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

It is an object to improve a conventional point that mounting an electronic component that requires a high current and heat radiation, such as an LED, together with other general electronic components on the same board has been difficult. To achieve this object, a different thickness lead frame partially having different thicknesses is used. On a thick portion of the different thickness lead frame, a special electronic component, such as an LED, for which a high current and heat radiation are required is mounted. Further, a thin portion of the different thickness lead frame is formed at a fine pitch, and general electronic components are mounted at a high density on the thin portion. Thus, unitization or modularization of electronic components for which a high current and heat radiation are required becomes possible.


Find Patent Forward Citations

Loading…