The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8263686 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 11, 2012

Filed:

Jul. 01, 2008
Applicants:

Hideharu Takeuchi, Tsukuba, JP;

Kouki Hamata, Tsukuba, JP;

Masaki Kobayashi, Tsukuba, JP;

Minoru Murata, Tsukuba, JP;

Takahiro Koshimizu, Hadano, JP;

Inventors:

Hideharu Takeuchi, Tsukuba, JP;

Kouki Hamata, Tsukuba, JP;

Masaki Kobayashi, Tsukuba, JP;

Minoru Murata, Tsukuba, JP;

Takahiro Koshimizu, Hadano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 9/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides an optical semiconductor encapsulating composition comprising (A) an epoxy compound, (B) a carboxylic anhydride curing agent, (C) a curing accelerator, and (D) surface-coated silica particles having an average particle diameter of 5 to 50 nm in which 0.2 to 3 mmol of a silane coupling agent (D2) that contains an epoxy group-containing silane coupling agent (d1) is reacted with 1 g of silica particles (D1) to surface-coat the silica particles, the epoxy group being converted into a hydroxyl group through ring opening; and an optical semiconductor device in which an optical semiconductor is encapsulated with the composition.


Find Patent Forward Citations

Takeuchi, Hideharu. (2012). Optical semiconductor-sealing composition (U.S. Patent No. 8263686). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8263686

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