The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2012

Filed:

May. 11, 2010
Applicants:

Bong-kyun Kim, Incheon, KR;

Jong-hyun Choung, Hwaseong-si, KR;

Byeong-jin Lee, Seoul, KR;

Sun-young Hong, Yongin-si, KR;

Hong-sick Park, Suwon-si, KR;

Shi-yul Kim, Yongin-si, KR;

Ki-beom Lee, Seoul, KR;

Sam-young Cho, Uiwang-si, KR;

Sang-woo Kim, Seongnam-si, KR;

Hyun-cheol Shin, Suwon-si, KR;

Won-guk Seo, Seoul, KR;

Inventors:

Bong-Kyun Kim, Incheon, KR;

Jong-Hyun Choung, Hwaseong-si, KR;

Byeong-Jin Lee, Seoul, KR;

Sun-Young Hong, Yongin-si, KR;

Hong-Sick Park, Suwon-si, KR;

Shi-Yul Kim, Yongin-si, KR;

Ki-Beom Lee, Seoul, KR;

Sam-Young Cho, Uiwang-si, KR;

Sang-Woo Kim, Seongnam-si, KR;

Hyun-Cheol Shin, Suwon-si, KR;

Won-Guk Seo, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/44 (2010.01); C09K 13/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

An etchant includes about 0.1 percent by weight to about 30 percent by weight of ammonium persulfate (NH)SO, about 0.1 percent by weight to about 10 percent by weight of an inorganic acid, about 0.1 percent by weight to about 10 percent by weight of an acetate salt, about 0.01 percent by weight to about 5 percent by weight of a fluorine-containing compound, about 0.01 percent by weight to about 5 percent by weight of a sulfonic acid compound, about 0.01 percent by weight to about 2 percent by weight of an azole compound, and a remainder of water. Accordingly, the etchant may have high stability to maintain etching ability. Thus, manufacturing margins may be improved so that manufacturing costs may be reduced.


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