The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2012
Filed:
Nov. 24, 2010
Megan Nicole Watson, Kent, WA (US);
Joseph L. Hafenrichter, Seattle, WA (US);
Mary H. Vargas, Woodinville, WA (US);
Michael W. Evens, Burien, WA (US);
Megan Nicole Watson, Kent, WA (US);
Joseph L. Hafenrichter, Seattle, WA (US);
Mary H. Vargas, Woodinville, WA (US);
Michael W. Evens, Burien, WA (US);
The Boeing Company, Chicago, IL (US);
Abstract
Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.