The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2012
Filed:
Aug. 04, 2008
Axel Kaltenbacher, Ingolstadt, DE;
Michael Kaspar, Putzbrunn, DE;
Gernot Schimetta, München, DE;
Karl Weidner, München, DE;
Robert Weinke, München, DE;
Jörg Zapf, München, DE;
Axel Kaltenbacher, Ingolstadt, DE;
Michael Kaspar, Putzbrunn, DE;
Gernot Schimetta, München, DE;
Karl Weidner, München, DE;
Robert Weinke, München, DE;
Jörg Zapf, München, DE;
Siemens Aktiengesellschaft, Munich, DE;
Abstract
One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.