The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2012

Filed:

Sep. 10, 2009
Applicants:

Matthias Schmitt, München, DE;

Stefan Schendzielorz, Ulm, DE;

Inventors:

Matthias Schmitt, München, DE;

Stefan Schendzielorz, Ulm, DE;

Assignee:

Voith Patent GmbH, Heidenheim, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06G 7/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of surface topography prognosis for a tissue paper which is to be produced in a manufacturing process by utilizing a structured fabric and into which a structure is embossed by way of the fabric, the surface topography of at least one structured fabric which is already used in the production process is plotted by way of a sensor. Originating from the surface topography of the already utilized structured fabric, the surface topography of the tissue paper is simulated through data processing, through a simulation of the paper production process. The algorithm used for the simulation is calibrated with the aid of a comparison of the simulated surface topography of the tissue paper with the surface topography of the actual tissue paper produced with the structured fabric, which is already being utilized in the production process. Originating from the surface topography of a respective additional structured fabric the simulation of the surface topography of the tissue paper is subsequently conducted by utilizing the calibrated algorithm in order to provide a prognosis of the tissue paper's surface topography that can be expected.


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