The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2012
Filed:
Jun. 05, 2007
Rabin Bhattacharya, Eindhoven, NL;
Pieter Jacob Snijder, Eindhoven, NL;
Liesbeth Van Pieterson, Eindhoven, NL;
Erich Zainzinger, Hong Kong, HK;
Martijn Krans, Eindhoven, NL;
Sima Asvadi, Eindhoven, NL;
Alexander Ulrich Douglas, Eindhoven, NL;
Jacqueline Van Driel, Eindhoven, NL;
Martinus Jacobus Johannes Hack, Eindhoven, NL;
Rabin Bhattacharya, Eindhoven, NL;
Pieter Jacob Snijder, Eindhoven, NL;
Liesbeth Van Pieterson, Eindhoven, NL;
Erich Zainzinger, Hong Kong, HK;
Martijn Krans, Eindhoven, NL;
Sima Asvadi, Eindhoven, NL;
Alexander Ulrich Douglas, Eindhoven, NL;
Jacqueline Van Driel, Eindhoven, NL;
Martinus Jacobus Johannes Hack, Eindhoven, NL;
Koninklijke Philips Electronics N.V., Eindhoven, NL;
Abstract
A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.