The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2012
Filed:
Dec. 10, 2010
Kaori Morita, Aichi, JP;
Tomoyasu Yamada, Aichi, JP;
Tamotsu Kiyakawauchi, Aichi, JP;
Akitomi Katsumura, Aichi, JP;
Koji Shiozawa, Aichi, JP;
Kaori Morita, Aichi, JP;
Tomoyasu Yamada, Aichi, JP;
Tamotsu Kiyakawauchi, Aichi, JP;
Akitomi Katsumura, Aichi, JP;
Koji Shiozawa, Aichi, JP;
Sony Corporation, Tokyo, JP;
Abstract
Disclosed herein is a card device including a semiconductor package section having memory functions and a substrate section joined to the semiconductor package section by superposition and mounted by a variety of electronic components. The semiconductor package section includes a card-side connector section having card-side terminals for inputting and outputting information signals, and package-side terminals at a location at which the semiconductor package section is joined to the substrate section by superposition. The substrate section includes substrate-side terminals at a location at which the substrate section is connected to the semiconductor package section by superposition. The substrate section is electrically joined to the semiconductor package section by making use of the package-side terminals and the substrate-side terminals. The superposition junction between the semiconductor package section and the substrate section is provided with such an offset that the card-side connector protrudes out off the card device.