The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2012
Filed:
Oct. 19, 2005
Thomas Omega Wheless, Jr., Eagle, ID (US);
Randall Don Briggs, Boise, ID (US);
Thomas Omega Wheless, Jr., Eagle, ID (US);
Randall Don Briggs, Boise, ID (US);
Avago Technologies General IP (Singapore) Pte. Ltd., Singapore, SG;
Abstract
An integrated circuit packaging apparatus includes a first conductive layer disposed between an integrated circuit die and a conductive die paddle. Bond wires connect the first conductive layer to the lead frame package and to the integrated circuit die. A first dielectric layer is disposed between the first conductive layer and the conductive die paddle such that the first conductive layer, the first dielectric layer, and the conductive die paddle provide bypass capacitance. A method for providing bypass capacitance and power routing for an integrated circuit packaging apparatus includes; depositing a first dielectric layer on a conductive die paddle, depositing a first conductive layer on the first dielectric layer, and connecting the first conductive layer to the lead frame package and to the integrated circuit die. The first conductive layer, the first dielectric layer, and the conductive die paddle cooperate to provide bypass capacitance.