The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2012
Filed:
Mar. 20, 2007
Younes Shabany, San Jose, CA (US);
Hans Yum, Santa Clara, CA (US);
Todd Collis, Hoffman Estates, IL (US);
Steve Bisbikis, Hawthorn Woods, IL (US);
Steve Koo, Chicago, IL (US);
Kieran Miller, Santa Clara, CA (US);
Younes Shabany, San Jose, CA (US);
Hans Yum, Santa Clara, CA (US);
Todd Collis, Hoffman Estates, IL (US);
Steve Bisbikis, Hawthorn Woods, IL (US);
Steve Koo, Chicago, IL (US);
Kieran Miller, Santa Clara, CA (US);
Flextronics AP, LLC, Broomfield, CO (US);
Abstract
Provided are electronics chassis having air inlets with increased cross-sectional area that facilitate airflow through the chassis and thereby provide improved cooling. As electronics chassis are often stacked, it has been determined that the upper surfaces of a lower chassis may be utilized to at least partially define the air inlet of the upper chassis. In this regard, an upper portion of the lower chassis may be removed to increase the size of an air inlet. That is, portions of an upper wall and/or the top wall of a lower chassis are removed and connected by a connecting wall (e.g. a tapered and/or a chamfered wall). Likewise, the bottom wall of an upper chassis may be removed. When stacked, the air inlet of the upper chassis may be disposed above the truncated portion of the lower chassis. In such an arrangement, the size of the resulting air intake is significantly increased.