The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2012

Filed:

Dec. 16, 2010
Applicants:

Katsuji Matsumoto, Kanagawa, JP;

Shusaku Yanagawa, Kanagawa, JP;

Shuichi Oka, Kanagawa, JP;

Shinji Rokuhara, Kanagawa, JP;

Inventors:

Katsuji Matsumoto, Kanagawa, JP;

Shusaku Yanagawa, Kanagawa, JP;

Shuichi Oka, Kanagawa, JP;

Shinji Rokuhara, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board laminated module includes: a first circuit board having a multi-layer structure in which ground layers are provided in a plurality of layers; a second circuit board mounted on the first circuit board; and a semiconductor chip mounted on the second circuit board, wherein in the first circuit board, a noise guiding through via which guides an electromagnetic noise generated in the semiconductor chip to a lower layer side is provided on a side different from a circuit portion or a circuit element desired to be protected against influence of the electromagnetic noise in a surrounding direction of an occurrence place of the electromagnetic noise.


Find Patent Forward Citations

Loading…