The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
Aug. 05, 2010
Takashi Sakurai, Tokyo, JP;
Shinya Yoshihara, Tokyo, JP;
Ko Onodera, Tokyo, JP;
Hisayuki Abe, Tokyo, JP;
Masahiko Konno, Tokyo, JP;
Satoshi Kurimoto, Tokyo, JP;
Hiroshi Shindo, Tokyo, JP;
Akihiro Horita, Tokyo, JP;
Genichi Watanabe, Tokyo, JP;
Yoshikazu Ito, Tokyo, JP;
Takashi Sakurai, Tokyo, JP;
Shinya Yoshihara, Tokyo, JP;
Ko Onodera, Tokyo, JP;
Hisayuki Abe, Tokyo, JP;
Masahiko Konno, Tokyo, JP;
Satoshi Kurimoto, Tokyo, JP;
Hiroshi Shindo, Tokyo, JP;
Akihiro Horita, Tokyo, JP;
Genichi Watanabe, Tokyo, JP;
Yoshikazu Ito, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrodeis provided with a ground electrode layerof Cu having been formed by firing, a solder layerformed of a lead-free solder based on five elements of Sn—Ag—Cu—Ni—Ge, and a diffusion layerhaving been formed by the diffusion of Ni between the ground electrode layerand the solder layer. Because the diffusion layerof Ni is formed between the ground electrode layerand the solder layer, the diffusion layer, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer. The diffusion layerof Ni can also suppress the growth of fragile intermetallic compounds of Sn—Cu. Therefore, a decrease in the bonding strength between the ground electrode layerand the solder layercan be prevented.