The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
Nov. 13, 2009
Seiichi Nishihara, Kameoka, JP;
Shuji Matsumoto, Omihachiman, JP;
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Seiichi Nishihara, Kameoka, JP;
Shuji Matsumoto, Omihachiman, JP;
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the external electrode and the component main body. A brazing material containing Ti is applied to at least one portion of a surface on which external electrodes of a component main body is formed, and by baking this brazing material, a metal layer containing Ti is formed. Moreover, the external electrodes are formed by a plating process so as to coat at least the metal layer, and a heating process is then carried out so as to cause counter diffusion between the metal layer and the plated film that is to form the external electrodes.