The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
May. 13, 2009
Jeffrey S. Bostak, San Martin, CA (US);
Vincent G. Dominic, Dayton, OH (US);
Parmijit Samra, Fremont, CA (US);
Michael Kauffman, Campbell, CA (US);
Jeffrey S. Bostak, San Martin, CA (US);
Vincent G. Dominic, Dayton, OH (US);
Parmijit Samra, Fremont, CA (US);
Michael Kauffman, Campbell, CA (US);
Infinera Corporation, Sunnyvale, CA (US);
Abstract
Embodiments of the present invention provide arrays of electrical circuits having one or more chirped elements or components for providing output signals to corresponding arrays of electro-optic devices. Certain embodiments of the present invention include a plurality of modulator driver circuits, each of the plurality of driver circuits configured to be substantially identical to each other and provide a corresponding one of a plurality of modulator drive signals to a respective one of a plurality of electro-optic modulators, each of the plurality of modulator driver circuits being chirped to provide a desired output to the corresponding electro-optic modulator for enhanced operation. Each of the plurality of modulator driver circuits comprises a plurality of electrical components, at least one of the electrical components being chirped such that a design or operating parameter of the electrical component differs from an electrical component having a similar function in at least one of the remaining modulator driver circuits of the plurality of driver circuit. In certain embodiments, each of the plurality of modulator driver circuits is provided on a common substrate.