The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
Dec. 04, 2009
Charles Nickel, Williamsburg, MA (US);
Katherine Nickel, Legal Representative, Williamsburg, MA (US);
David Lidsky, Oakland, CA (US);
Seth Kahn, San Francisco, CA (US);
Charles Nickel, Williamsburg, MA (US);
Katherine Nickel, legal representative, Williamsburg, MA (US);
David Lidsky, Oakland, CA (US);
Seth Kahn, San Francisco, CA (US);
Volterra Semiconductor Corporation, Fremont, CA (US);
Abstract
A detection circuit and one or more wires or circuit traces are included in a die. The combination is used to detect mechanical failure of the substrate, e.g. silicon after singulation of the dice from the wafer. Failures may be detected at different regions or planes within the die, and the tests may be performed during operation of the packaged die and integrated circuit, even after installation and during operation of a larger electronic device in which it is incorporated. This is especially useful for chip scale packages, but may be utilized in any type of IC package.