The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
Apr. 08, 2010
Noriko Numata, Tokyo, JP;
Hiroshi Sato, Tokyo, JP;
Toru Ueguri, Tokyo, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
In a method for manufacturing a semiconductor device involving the step of bonding a metallic ribbon to a pad of a semiconductor chip, breakage of the metallic ribbon is to be prevented while ensuring the bonding strength even when the metallic ribbon becomes thin with reduction in size of the semiconductor chip. In bonding an Al ribbon to a pad of a semiconductor chip by bringing a pressure bonding surface of a wedge tool into pressure contact with the Al ribbon while applying ultrasonic vibration to the ribbon positioned over the pad, recessesare formed beforehand at both end portions respectively of the wedge tool lest both end portions in the width direction of the Al ribbon bonded to the pad should contact the pressure bonding surface of the wedge tool.