The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
Apr. 28, 2011
Applicants:
Jin-wook Jang, Scottsdale, AZ (US);
Shun Meen Kuo, Chandler, AZ (US);
Inventors:
Jin-Wook Jang, Scottsdale, AZ (US);
Shun Meen Kuo, Chandler, AZ (US);
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method and device are disclosed in which a a lead-free or low-lead die attach material is applied to a surface. An electronic die is positioned on the die attach material. An oxide of at least a specified thickness is formed over an exposed portion of the die attach material. Wire bonds are formed between the electronic die and the surface, and an encapsulant material is applied over the surface, the oxide, and the electronic die.