The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
Aug. 12, 2008
Se-young Lee, Suwon-si, KR;
You-seung Jin, Seoul, KR;
Geon-woo Park, Suwon-si, KR;
Abstract
A semiconductor device can include a semiconductor chip, a protective layer pattern, an under bump metallurgy (UBM) layer, and conductive bumps. The semiconductor chip can include a pad and a guard ring. The protective layer pattern can be formed on the semiconductor chip to expose the pad and the guard ring. The UBM layer can be formed on the protective layer and can directly make contact with the pad and the guard ring. The conductive bumps can be formed on a portion of the UBM layer on the pad. Thus, the UBM layer and the guard ring can directly make contact with each other, so that a uniform current can be provided to the UBM layer on the pad regardless of a thick difference of different portions of the UBM layer.