The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
Apr. 01, 2009
Chang Ho Cho, Gyeonggi-do, KR;
Sung Hyun Kim, Daejeon, KR;
Raisa Kharbash, Daejeon, KR;
Keon Woo Lee, Daejeon, KR;
Sang Kyu Kwak, Daejeon, KR;
Dong Kung OH, Daejeon, KR;
Chang Soon Lee, Daejeon, KR;
Kyoung Hoon Min, Daejeon, KR;
Chang Ho Cho, Gyeonggi-do, KR;
Sung Hyun Kim, Daejeon, KR;
Raisa Kharbash, Daejeon, KR;
Keon Woo Lee, Daejeon, KR;
Sang Kyu Kwak, Daejeon, KR;
Dong Kung Oh, Daejeon, KR;
Chang Soon Lee, Daejeon, KR;
Kyoung Hoon Min, Daejeon, KR;
LG Chem, Ltd., Seoul, KR;
Abstract
A novel photoactive compound is provided. The photoactive compound has a structure represented by Formula 1: The photoactive compound efficiently absorbs UV light. Accordingly, the photoactive compound has an improved ability to generate radicals and is efficiently photopolymerized with unsaturated bonds. Further provided is a photosensitive resin composition comprising the photoactive compound. The photosensitive resin composition has good sensitivity because it efficiently absorbs UV light. In addition, the photosensitive resin composition has excellent characteristics in terms of residual film ratio, mechanical strength and resistance to heat, chemicals and development. Therefore, the photosensitive resin composition is advantageously used in curing materials for column spacers, overcoats and passivation films of liquid crystal display devices. In addition, the photosensitive resin composition has excellent thermal processing characteristics.