The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
Aug. 26, 2009
Dieter Schwanke, Hof, DE;
Christian Zeilmann, Bayreuth, DE;
Michael Krenkel, Vaihingen, DE;
Biotronik CRM Patent AG, Baar, CH;
Abstract
An LTCC substrate structure with at least one contact element for connecting a wire conductor, which has a first metallization () arranged on and/or in the ceramic substrate for electrical connection to the wire conductor, wherein the first metallization () preferably contains silver or a silver alloy. To avoid via posting or a plating process, a diffusion barrier layer covering the first metallization or metal layer, which diffusion barrier layer () covering the first metallization (), which diffusion barrier layer is produced with a locally acting application method, and a second metal layer () arranged on the diffusion barrier layer () are provided, wherein the second metal layer () preferably contains gold and/or platinum and/or an alloy that has at least one of these elements. The invention also discloses a production method for an LTCC substrate structure of this type.