The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2012
Filed:
Mar. 18, 2011
Atsushi Ono, Shiojiri, JP;
Yoshihiro Kobayashi, Komagane, JP;
Shojiro Kitamura, Suwa-gun, JP;
Masayuki Matsunaga, Minowa-machi, JP;
Akitoshi Hara, Suwa-gun, JP;
Atsushi Ono, Shiojiri, JP;
Yoshihiro Kobayashi, Komagane, JP;
Shojiro Kitamura, Suwa-gun, JP;
Masayuki Matsunaga, Minowa-machi, JP;
Akitoshi Hara, Suwa-gun, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin. The mounting surface includes: an exposed surface of the resin between the first and second substrates, and side surfaces of the first and second substrates adjacent to the exposed surface. The first electrode is disposed at an end of the first surface adjacent to the mounting surface and electrically coupled to the electric element. The second electrode is disposed at an end of the second surface adjacent to the mounting surface.