The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2012
Filed:
Mar. 19, 2007
Hitoshi Ishimoto, Hyogo, JP;
Nobuya Matsutani, Osaka, JP;
Hidenori Uematsu, Osaka, JP;
Koji Shimoyama, Hyogo, JP;
Michio Ohba, Osaka, JP;
Mikio Taoka, Osaka, JP;
Hitoshi Ishimoto, Hyogo, JP;
Nobuya Matsutani, Osaka, JP;
Hidenori Uematsu, Osaka, JP;
Koji Shimoyama, Hyogo, JP;
Michio Ohba, Osaka, JP;
Mikio Taoka, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
In an inductance component, a stress is not locally applied even in the condition where heat is applied to entire component, such as when implementing soldering, so that high reliability is realized. For realizing this, the component includes an element, a coil formed in the element, terminals electrically connected to the coil, and magnetic layers arranged so as to be substantially parallel to a winding surface of the coil are formed in the element and the entirety of the magnetic layers is covered with a material of which thermal expansion and contraction rate is uniform.