The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2012
Filed:
Nov. 23, 2010
Takashi Oda, Ibaraki, JP;
Shigenori Morita, Ibaraki, JP;
Takashi Oda, Ibaraki, JP;
Shigenori Morita, Ibaraki, JP;
Nitto Denko Corporation, Ibaraki-shi, JP;
Abstract
A conductor layeris formed as a circuit pattern on a base insulating layer, a terminalis formed thereon, and a supporting columnis formed in the vicinity of the terminal on the upper face of the base insulating layer. Here, supposing the protrusion height B of the bump from the element to be connected is B, the height of the supporting column is H, the height of the terminal is h, and the layer thickness of the terminal is t, as measured from the upper face of the base insulating layer as the reference surface, the height H of the supporting column is determined to satisfy B<H<h+B wherein t<B, or h<H<h+B wherein t≧B. As a result, the supporting column functions as a spacer to suppress compression that causes the solder of the terminal to reach the electrode of the element.