The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2012
Filed:
Jul. 15, 2009
Chia-nan Pai, Taipei Hsien, TW;
Han-long Chen, Shenzhen, CN;
Ning LI, Shenzhen, CN;
Shou-kuo Hsu, Taipei Hsien, TW;
Chia-Nan Pai, Taipei Hsien, TW;
Han-Long Chen, Shenzhen, CN;
Ning Li, Shenzhen, CN;
Shou-Kuo Hsu, Taipei Hsien, TW;
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, Guangdong Province, CN;
Hon Hai Precision Industry Co., Ltd., Tu-Cheng, New Taipei, TW;
Abstract
A motherboard interconnection device includes a top layer, a bottom layer, a first and a third electronic elements positioned on the top layer, and a second and a fourth electronic elements positioned on the bottom layer. A first end of the first electronic element on the top layer is connected to the first end of the second electronic element on the bottom layer with a first via hole, and the first end of the third electronic element on the top layer is connected to the first end of the fourth electronic element on the bottom layer with a second via hole. The second ends of the two electronic elements on the top layer are connected to a first part, and the second ends of the two electronic elements on the bottom layer are connected to a second part.