The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2012

Filed:

Mar. 22, 2010
Applicants:

Hideki Yarimizu, Itabashi-ku, JP;

Hideki Tokui, Itabashi-ku, JP;

Hiroto Minamisawa, Itabashi-ku, JP;

Inventors:

Hideki Yarimizu, Itabashi-ku, JP;

Hideki Tokui, Itabashi-ku, JP;

Hiroto Minamisawa, Itabashi-ku, JP;

Assignee:

GC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61K 6/083 (2006.01); C08K 3/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide a polymerizable composition having more excellent preservation stability of pastes than a conventional composition using a combination of a copper compound, cumene hydroperoxide, and N-acetylthiourea, and having a polymerization curing time which does not change with time, that is, does not delay or quicken from a time set for a product even though the composition is stored, the polymerizable composition includes a first paste and a second paste, wherein the first paste includes a polymer of α-β unsaturated monocarboxylic acid or α-β unsaturated dicarboxylic acid, water, and a hydroperoxide as a peroxide, and the second paste includes a (meth)acrylate compound not having an acid group, fluoroaluminosilicate glass powder, a thiourea derivative as a reducing material, and a vanadium compound as a polumerization accelerator.


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