The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2012
Filed:
Oct. 09, 2008
Takeshi Inohara, Yao, JP;
Yoshiaki Shirakabe, Yao, JP;
Ikuo Yosejima, Yao, JP;
Kenichi Kitano, Yao, JP;
Toshiaki Masuda, Yao, JP;
Takeshi Inohara, Yao, JP;
Yoshiaki Shirakabe, Yao, JP;
Ikuo Yosejima, Yao, JP;
Kenichi Kitano, Yao, JP;
Toshiaki Masuda, Yao, JP;
Matsumoto Yushi-Seiyaku Co., Ltd., Yao-Shi, JP;
Abstract
Heat-expandable microspheres include a shell of thermoplastic resin and core material encapsulated in the shell. The core material include a blowing agent having a boiling point not higher than the softening point of the thermoplastic resin and a gas migration inhibitor having a boiling point higher than the softening point of the thermoplastic resin. The ratio of the gas migration inhibitor to the core material is at least 1 weight percent and below 30 weight percent. The average particle size of the heat-expandable microspheres ranges from 1 to 100 micrometers.