The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2012

Filed:

Mar. 02, 2009
Applicants:

Hiroyuki Hosoya, Tama, JP;

Koji Tsunekawa, Tokyo, JP;

Yoshinori Nagamine, Tama, JP;

Inventors:

Hiroyuki Hosoya, Tama, JP;

Koji Tsunekawa, Tokyo, JP;

Yoshinori Nagamine, Tama, JP;

Assignee:

Canon Anelva Corporation, Kawasaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/35 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to the present invention, it can be switched whether or not to apply a magnetic field to a substrate depending on a material of a film to be formed, and a magnetic layer and a non-magnetic layer can be formed in the same chamber. A sputtering apparatusincludes a substrate holderconfigured to support a substrate W; magnet holdersthat are disposed around the substrate holder; magnetsthat are movably loaded on the magnet holders; supporting membersthat protrude from the substrate holder so as to face the magnets; connecting membersthat protrude from the magnets to face the substrate holder; a rotation mechanismconfigured to rotationally move at least one of the substrate holder and the magnet holders; and a connection switching mechanismconfigured to move, when positions of the supporting members and the connecting members are matched to each other by rotational movement of the rotation mechanism, the substrate holder upward and downward to engage the supporting members and the connecting members with each other or separate the supporting members and the connecting members from each other, and switch whether or not to apply a magnetic field to the substrate W.


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