The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2012

Filed:

Nov. 24, 2010
Applicants:

Hiroaki Murakami, Osaka, JP;

Tomio Yamakawa, Osaka, JP;

Tadashi Douhara, Osaka, JP;

Masayuki Sagara, Osaka, JP;

Inventors:

Hiroaki Murakami, Osaka, JP;

Tomio Yamakawa, Osaka, JP;

Tadashi Douhara, Osaka, JP;

Masayuki Sagara, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21C 23/00 (2006.01); B21C 23/04 (2006.01); B21C 31/00 (2006.01); B21C 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A starting material to be extruded made of a high alloy comprising, in mass %, Cr: 20 to 30% and Ni: more than 22% and 60% or less is heated to a temperature predetermined according to the contents of Mo and W and is subjected to a hot-extrusion process, the heating temperature T (° C.) satisfying a relationship of Formula (1), (2), or (3), which is expressed in terms of the average cross-sectional area A (mm) of the starting material to be extruded, the extrusion ratio EL (−), and the extrusion speed V (mm/s). As a result, a high-alloy seamless tube can be produced without generating cracking and/or seam flaws.When 0%≦Mo+0.5W<4%:≦1343−0.001322×−1.059×−0.129×  (1)When 4%≦Mo+0.5W<7%:≦1316−0.001322×−1.059×−0.129×  (2)When 7%≦Mo+0.5W:≦1289−0.001322×−1.059×−0.129×  (3)


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