The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
Mar. 25, 2010
Jason Randolph Allen, Niskayuna, NY (US);
Jared Michael Crosby, Scotia, NY (US);
Christopher Joseph Uhl, Cincinnati, OH (US);
Michael Orlando Cimini, Cincinnati, OH (US);
Bianca Mary Mccartt, Cincinnati, OH (US);
James Walter Caddell, Milford, OH (US);
Jared Reece Reynolds, Fort Thomas, KY (US);
Robert William Tait, Niskayuna, NY (US);
Andrew Frank Ferro, West Chester, OH (US);
Jason Randolph Allen, Niskayuna, NY (US);
Jared Michael Crosby, Scotia, NY (US);
Christopher Joseph Uhl, Cincinnati, OH (US);
Michael Orlando Cimini, Cincinnati, OH (US);
Bianca Mary McCartt, Cincinnati, OH (US);
James Walter Caddell, Milford, OH (US);
Jared Reece Reynolds, Fort Thomas, KY (US);
Robert William Tait, Niskayuna, NY (US);
Andrew Frank Ferro, West Chester, OH (US);
General Electric Company, Niskayuna, NY (US);
Abstract
A thermal inspection system includes a fluid source configured to supply a warm flow and a cool flow, indirectly or directly, to internal passage(s) of a component. The system includes an imager configured to capture a time series of images corresponding to a transient thermal response of the component to the warm and cool flows. The system further includes at least one flow meter configured to measure the warm and cool flows supplied to the component and a processor operably connected to the imager. The processor determines the transient thermal response of the component around a transition time. The flow supplied to the component switches from the warm flow to the cool flow at the transition time. The processor compares the transient thermal response around the transition time with one or more baseline values or with an acceptable range of values to determine if the component meets a desired specification.