The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2012

Filed:

Aug. 26, 2011
Applicants:

Uk-song Kang, Seongnam-si, KR;

Hoe-ju Chung, Yongin-si, KR;

Jang-seok Choi, Seoul, KR;

Hoon Lee, Seoul, KR;

Inventors:

Uk-Song Kang, Seongnam-si, KR;

Hoe-Ju Chung, Yongin-si, KR;

Jang-Seok Choi, Seoul, KR;

Hoon Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A three dimensional memory module and system are formed with at least one slave chip stacked over a master chip. Through semiconductor vias (TSVs) are formed through at least one of the master and slave chips. The master chip includes a memory core for increased capacity of the memory module/system. In addition, capacity organizations of the three dimensional memory module/system resulting in efficient wiring is disclosed for forming multiple memory banks, multiple bank groups, and/or multiple ranks of the three dimensional memory module/system.


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