The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2012

Filed:

Aug. 31, 2010
Applicants:

Shi-piao Luo, Shenzhen, CN;

Chia-nan Pai, Taipei Hsien, TW;

Shou-kuo Hsu, Taipei Hsien, TW;

Inventors:

Shi-Piao Luo, Shenzhen, CN;

Chia-Nan Pai, Taipei Hsien, TW;

Shou-Kuo Hsu, Taipei Hsien, TW;

Assignees:

Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Hon Hai Precision Industry Co., Ltd., Tu-Cheng, New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A printed circuit board includes first and second layers, a control chip, bonding pads, and several electronic elements. The bonding pads can be selectively applied to interconnect the first and second layers, and the control chip with any of the electronic elements in a simple layout.


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