The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2012

Filed:

Nov. 10, 2009
Applicants:

Chen-tsun Juan, Miao-Li County, TW;

Bor-bin Chou, Miao-Li County, TW;

Li-wen Chang, Miao-Li County, TW;

Inventors:

Chen-Tsun Juan, Miao-Li County, TW;

Bor-Bin Chou, Miao-Li County, TW;

Li-Wen Chang, Miao-Li County, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 7/26 (2006.01); H01J 7/24 (2006.01); H01J 61/52 (2006.01); G09F 13/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A light source module including a planar light source, a heat dissipation medium, and a heat dissipation element are disclosed. The planar light source includes a light box, electrodes, and an insulation layer. The light box has a light emitting surface and a bottom surface opposite to the light emitting surface. The electrodes and the insulation layer are disposed on the bottom surface, and the insulation layer covers the electrodes. The heat dissipation medium is disposed on the insulation layer. The heat dissipation element includes conductive contact portions contacting the heat dissipation medium and a conductive connection portion connecting the conductive contact portions, wherein the orthographic projections of the conductive contact portions and the orthographic projections of the electrodes on the bottom surface are not overlapped by each other, and airflow channels are formed between the conductive contact portions, the conductive connection portion, and the heat dissipation medium.


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