The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2012

Filed:

Sep. 18, 2007
Applicants:

Andrew L. Robinson, Bellevue, WA (US);

Richard E. Davidsen, Andover, MA (US);

Inventors:

Andrew L. Robinson, Bellevue, WA (US);

Richard E. Davidsen, Andover, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/047 (2006.01);
U.S. Cl.
CPC ...
Abstract

An acoustic assembly that includes an integrated circuit package having an electrically conductive via configured to pass from an active portion of the integrated circuit package through a bottom portion of the integrated circuit package. The bottom portion is a bottom side of a substrate of the integrated circuit package. An acoustic element is positioned on the bottom side of the substrate and the via is arranged to electrically couple the active portion of the integrated circuit package to the acoustic element. In one embodiment, the acoustic element is an acoustic stack and the integrated circuit package is an ASIC. The assembly microbeamformed transducer.


Find Patent Forward Citations

Robinson, Andrew. (2012). Flip-chip interconnection through chip vias (U.S. Patent No. 8242665). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8242665

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…