The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
Aug. 31, 2009
Applicant:
Norikazu Motohashi, Kanagawa, JP;
Inventor:
Norikazu Motohashi, Kanagawa, JP;
Assignee:
Renesas Electronics Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/301 (2006.01);
U.S. Cl.
CPC ...
Abstract
There is provided a method for manufacturing a semiconductor device, including: forming an interconnection layer over a support base; mounting a plurality of semiconductor chips over the interconnection layer; molding the plurality of semiconductor chips with resin; forming an alignment mark in the resin; and obtaining a molded structure by removing the interconnection layer, the plurality of semiconductor chips and the resin from the support base after forming the alignment mark.